Lugar del origen
Guangdong, China
Materia prima principal
Epoxi
Aplicación
Construcción, Embalaje, Electrical appliances
Otros Nombres
Chip bottom filling potting epoxy primer
Clasificación
Otros adhesivos
Tipo
Chip bottom filling potting epoxy primer
Product name
Chip bottom filling potting epoxy primer
Material
One-component potting materials
Storage temperature
-20-8℃
Curing method
Heat curing
Use
for CSP, WLCSP and BGA applications
Color
Light yellow to amber
Product Description
reusable underfill
Curing system
cure quickly at moderate temperatures
Feature
higher glass transition temperature and higher fracture toughness
Glue type
Epoxy resin-based
