Lugar del origen
Guangdong, China
Estado del producto
Relleno
Estilo
Con ventilador, Con ventana de panel lateral
Dimensions(W x D x H)
437.5mm x 650mm x 132mm
M/B Form Factor
Support MAX 12" x 13" motherboard
Material
Quality Fine 1.0mm SGCC Steel
Backplane
12Gb/s MIni SAS backplane
Drives Bay
16 x 3.5" hot-swap SATA (II or III) / SAS (II or III) 6Gb/s drive bays
Cooling Fan
3pcs 120mm ball bearing fans.
Power Supply Support
2U standard power suppy or redundant power supply
Epansion Space
7 PCI/PCIE expansion slots
Connector
Two front accessible USB2.0 ports
Applicarion
Internet of things, cloud computing, security monitoring, etc
